A convenient felt-tipped conversion coating repair tool.

Liquid chemical used to produce a protective coating on aluminum or aluminum alloys

Chrome-free zirconium polymer conversion coating for aluminum

Complex trivalent chromium conversion coating formulated for treating aluminum and its alloys

Cleaner is a blend of inorganic alkaline components which remove moderate to heavy deposits of mill oil from ferrous substrates

Appearance enhancing seal rinse technology

Economical, low bake, environmentally friendly corrosion protection coating for steel parts

Formulated for spray and immersion application to steel, aluminum and zinc surfaces to simultaneously clean and develop a conversion coating.

Chrome pretreatment for sheet and stripline applications

Dry-in-place conversion coating for steel.

Conversion coating process for cold forming

Formulated for spray application on multi-metal substrates prior to electrocoating.

Polycrystalline conversion coating designed for multi-metal immersion applications.

Biostable bodymaker coolant for drawing and ironing of aluminum beverage cans

Cupper lubricant for drawing and ironing of aluminum beverage cans

Cupper lubricant for drawing and ironing of aluminum beverage cans

A conveniently packaged release agent wipe for high performance composite assemblies

A conveniently packaged release agent wipe for high performance composite assemblies

A Low VOC Semi-permanent release agent for high performance composite assembly

A semi-permanent release agent formulated specifically for release of all cast polymer products and for releasing highly filled resins

Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins

Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins

A water based cleaner developed for removing residue from mold surfaces

Water-based mold release for polyurethane elastomers

Water-bassed mold release agent for rubber goods

Water-based mold release agent for the more difficult molding applications for rubber goods

A water based release agent formulated for the most difficult to release molding applications

Water-based mold release agent for easy molding application of rubber goods

Water-based mold release agent for rotation molding application

Unique water-based release agent with high temperature stability for thermoset composites

A cleaner and mold release for polyester mold surfaces

Semi-permanent, polymeric release agent for flange sealing on composite molds

Silicone mold release agent

Mold sealer for fiberglass reinforced polyester, epoxy and other composite molds

Semi-permanenant mold release agent specifically formulated for reinforced polyester gel coats

Offers a high gloss finish with excellent part detail and mold geometry retention

Mold cleaner designed to dissolve and remove wax from polyester molds without dulling the surface

release interface for RIM and R/RIM polyurethane processes

A unique polymer release agent designed for all gel-coat fiberglass reinforced and filled polyester composites

A low VOC semi-permanent release agent for polyester gel-coat parts

A conveniently packaged release agent wipe for polyester gel-coat parts

Zinc rich, weldable primer

Nitrile/phenolic, water based primer

Blue & Gold is a one part, low temperature fusing epoxy powder especially designed for all types of capacitors including film, ceramic and tantalum.

One part, epoxy coating powder designed for the encapsulation of various types of electronic devices

RTM resin, 250 °F/121 °C service, epoxy, two component

Adhesive primer, solvent based, high temperature, 350 °F/177 °F curing, chromated

Adhesive primer, solvent based, high temperature, 350 °F/177 °F curing, chromated

Toughened paste, high peel, two component, ambient cure, 180 °F/82 °C service

Toughened paste, high peel, two component, ambient cure, 180 °F/82 °C service

Filled paste, 250 °F/121 °C service temperature, ambient cure

Toughened paste, thixotropic, 180 °F/82 °C service

Filled paste, 300 °F/149C service temperature, ambient cure

Toughened paste, high peel strength, volumetric mix ratio, 200 °F/93 °C service temperature

Toughened paste, high elongation, 140 °F/60 °C service temperature

Toughened paste 250 °F/121 °C service temperature, structural

Toughened paste, 350 °F/177 °C service temperature, thixotropic

Filled paste, liquid shim, fast cure, 225 °F/107 °C service temperature

Non-metallic filled paste adhesive, thixotropic, liquid shim, 350 °F/177 °F service, low peel

Syntactic low density paste, 300 °F/149 °F service, room temperature cure, lightweight

Low viscosity resin, 300 °F/149 °C service temperature, repair resin, room temperature cure

Lightweight fairing compound, 200 °F/93 °C service temperature, low density, sandable

Metal bond film adhesive, 250 °F/121 °C service temperature

Film adhesive, high temperature, 420 °F/216 °C service temperature

Film adhesive, 250 °F/121 °C cure, 300 °F/149 °C service temperature

Film adhesive, composite bonding, 300 °F/149 °C service temperature

Paste adhesive, one part, elevated cure, expanding, 250 °F/121 °C service temperature

Peel ply, pre-impregnated, polyester scrim

Toughened paste, high peel strength, volumetric mix ratio, 200 °F/93 °C service temperature

Low viscosity resin, 300 °F/149 °C service temperature, repair resin, room temperature cure

Solvent free, flexible, two-component epoxy potting system which meets the requirements of UL 94 VO, 1/4 inch.

One of a series of high performance, single component, semiconductor encapsulants for chip-on-board applications.

One component high performance epoxy encapsulant with high Tg and low extractable ionics.

One component epoxy potting system formulated to protect sensors used in harsh environments, such as automotive applications.

Undiluted epoxy, low viscosity casting system that exhibits exceptional resistance to impact and thermal shock.

Undiluted, silica filled epoxy casting compound, which exhibits improved thermal properties, lower shrinkage and lower expansion characteristics.

Filled epoxy system with a high operating temperature and long pot life.

Black, low cost, flexible, capable of UL94HB, resistant to thermal shock, non-abrasive filled, high impact strength, long pot life

Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life

Capable of UL94V-0, stable to 155C

Excellent imprgnation of the most demanding coils and transformers, very high strength and excellent crack resistance

Clear, low shrinkage, excellent chemical resistance, strong bond to substrates

Clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability, low viscosity, easy to handle

Excellent adhesion to a wide variety of substrates, resilient, low cracking

Low shrinkage, low thermal expansion high heat distortion temperature.

High operating temperature, excellent chemical resistance, long working life, excellent performance under high moisture and humidity.

High heat distortion temperature, low expansion, dimensionally stable

Very fast gel, fast cycle time

Two-component, long pot life, casting system with excellent handling properties.

Two-component casting system with excellent handling properties.

Two-component casting system with excellent handling properties.

Reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach.

High purity, self-leveling liquid epoxy encapsulant.

High purity, low stress liquid encapsulant with good moisture resistance and an extended working life.

High purity liquid encapsulant designed for use in applications utilizing lead-free solder.

Fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil.

High purity, self-leveling liquid epoxy encapsulant designed for larger cavity-fill or dam-and-fill applications.

One part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process.

Passive components, including all capacitor types

Black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors

Gold, ultra low stress, non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors

Ultra low stress, high adhesion molding compound

Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled

Green (non-Bromine, non-Antimony, non-Phosphorous) epoxy cresol novolac type, semiconductor grade molding compound

Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages

A low stress molding compound suitable for GBU, KBU and TO packages, providing superior moldability and reliability.

Standard molding compound suitable for ZIP, SIL and DIP packages, providing superior moldability and reliability.

Lowest cost of ownership with superior moldability and reliability, extremely suitable for DIP packages

Low thermal expansion and low stress molding compound suitable for DIP,PDIP,SOIC, SOP, SSOP packages, providing superior moldability and reliability.

Low stress and high reliability molding compound suitable for TO, SOP and SSOP packages.

Low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window.

High adhesion & low stress molding compound suitable for SOIC, D/D2-PAK and QFP packages.

High adhesion and high strength molding compound suitable for SOT,SOD,SSOP,TSOP,QFP and T/LQFP packages, providing ultra low stress, low moisture absorption, high purity and high reliability.

Standard molding compound suitable for PBGA and TFBGA packages, providing high adhesion and high strength, low stress, low warpage and high reliability.

Green mold compound suitable for Diodes, TO and PDIP packages; contains no bromine, antimony or phosphorus flame retardant.

High adhesion, ultra low stress, green mold compound suitable for TSOP, TSSOP and QFP; contains no bromine, antimony or phosphorus flame retardant.

Superior adhesion technology and enhanced reliability performance

High adhesion, ultra low stress, green mold compound suitable for TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony or phosphorus flame retardant.

High adhesion, low warpage and ultra low stress green mold compound suitable for QFN and contains no bromine, antimony or phosphorus flame retardant.

High adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant.

Epoxy core splice, 350 °F/177 °C service temperature

Epoxy core splice film, fire retardant, 350 °F/177 °C service temperature

Anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature

Power discrete, RF and high voltage rectifier, designed for high voltage power applications requiring good electrical stability at high temperature

Visually opaque, black epoxy molding compound specifically designed for IR electronic applications such as IR transceivers and IR photo modules

High productivity, low cost material designed for low voltage diodes and small signal transistors

Tantalum and ceramic capacitors, leaded surface mount sensors

Tantalum and ceramic capacitors, leaded surface mount sensors automotive

Delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements, low moisture absorption and low thermal expansion

High productivity, low stress, molding compound designed for high volume encapsulation of various surface mount devices

Transparent epoxy molding compound specifically designed for surface mount optoelectronic devices such as LEDs, image sensors and opto sensors.

Premier pelletized optoelectronic molding compound

Pelletized optoelectronic molding compound with advanced adhesion properties, enhanced cure speed

Water white casting system suitable for use on visible and I.R. L.E.D.

Low viscosity, long pot life encapsulating system that cures at 85 °C or above to yield clear water white castings

Solvent based one component urethane coating which may be cured at room temperature

Solvent-based, urethane coating; a one component, air-drying, room temperature cure, printed circuit coating material

Waterborne acrylic, one component coating recommended for printed board coating

One-component solvent based acrylic conformal coating to provide environmental and mechanical protection to printed circuit boards

Epoxy foaming paste, expanding, 350 °F/177 °C service temperature

Nitirile phenolic film adhesive, 270 °F/132 °C service temperature

Composite bond film adhesive, 300 °F/149 °C service temperature

Film adhesive, 300 °F/149 °C service, non-metallic filled

Film adhesive, high temperature 350 °F/177 °C service temperature, non-metallic filled

Film adhesive, composite bonding, 300 °F/149 °C service temperature

Composite surfacing film, epoxy

No dry Ag/glass die attach for glass seal packages

Low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal, seam seal and glass seal hermetic packages

Silver filled conductive adhesive for attachment of integrated circuits and components to advanced substrates

Highly silver filled, conductive adhesive designed to provide high (6-7 W/m °K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic lead frames

Silver-filled, no bleed conductive, UV curable die attach adhesive specifically recommended for NiPdAu leadframe applications

For stacked die application where the bonding wires go through the die attach paste and mold compound

Inexpensive, low viscosity, flexible, flame retardant, castor/MDI based urethane potting/encapsulating compound

Flexible, unfilled, potting compound; this system provides low viscosity for good flow and good adhesion to many substrates

General purpose, ultra clear epoxy paste

Formulated for spray application

General purpose epoxy, bonds and seals, machinable

High temperature and chemical resistant, gap filling, impact resistant, medium viscosity

Medium to fast setting, hot melt adhesive

High strength, high temperature, preapplied threadlocker

Medium strength threadlocker gel, no run formula

High strength, preapplied threadlocker designed for fasteners with plated surfaces

Low strength threadlocker for small screw.

Medium strength retaining compound for heavy interferences and high torque.

Medium strength threadlocker for active & inactive metals.

Medium strength threadlocker for active and inactive metals.

Medium - high strength threadlocker.

High strength, low viscosity threadlocker.

High strength, surface insensitive threadlocker.

Medium - high strength threadlocker for pre-assembled parts.

General purpose acrylic adhesive, designed to bond untreated low energy substrates such as polypropylene

Low modulus, high viscosity, UV/V light cure adhesive.

Thixotropic, flexible, low modulus, medium viscosity, UV/V light cure adhesive.

High strength, low viscosity, UV/V light cure adhesive.

Low viscosity, UV/V light cure adhesive.

Epoxy resin, part of a two part system to be used with a hardener, formulated for general purpose potting and encapsulating

Epoxy resin, part of a two part system to be used with a hardener, formulated for thermally conductive potting and encapsulating

Self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap

Polyurethane hardener, part of a two part system to be used with a resin, formulated for flame retardant potting and encapsulating

Thixotropic, flexible, UV/V, light cure adhesive.

Two-step, no-mix, fast fixturing, general purpose, solvent resistant adhesive

Low viscosity, slightly flexible, UV/V light cure adhesive.

Two-step, no-mix, high temperature, high viscosity, adhesive

Semi-rigid, general purpose, one-part, medium viscosity epoxy with excellent surface cure, low shrinkage, low outgassing

Low viscosity, UV/V light cure adhesive.

One-part dual-cure, toughened, high viscosity, magnet bonding adhesive

Medium viscosity, flexible, UV light cure adhesive.

Medium viscosity, UV light cure adhesive.

High viscosity, UV light cure adhesive.

High viscosity, UV light cure adhesive.

One component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation

One part, heat curable epoxy, designed as non-reworkable CSP/BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices

UV/V/Heat cure version of Loctite ® 3525

Fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices

One component heat cure epoxy designed for use as board level underfill for IC packages, such as CSPs and BGAs

High viscosity, fluorescing, visible light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering

Toughened, high strength moisture cure, hot melt adhesive

Polyolefin hot melt for plastic bonding

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

High viscosity, flexible, UV/V, light cure adhesive.

Medium viscosity, solvent free, UV light cure adhesive.

High viscosity, one part, room temperature cure, instant adhesive.

Thermally conductive adhesive system designed for bonding heat generating components to heat sinks

Low viscosity versatile epoxy casting system that exhibits high thermal conductivity and low thermal expansion

Low viscosity epoxy resin

Self-shimming, thermally conductive adhesive

Bead on bead thermally conductive adhesive, is a two-part filled acrylic thermally conductive adhesive designed for ease of use

Designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required

Clear acrylic formulated without chlorinated solvents or CFC's

Medium viscosity, UV/V light cure adhesive.

Low viscosity, UV/V light cure adhesive, fluorescing, sterilization resistance.

Medium viscosity UV/V light curing adhesive, fluorescing, sterilization resistance.

One-part dual-cure, toughened, high viscosity, magnet bonding adhesive

High viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance.

Medium viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance.

Medium viscosity, UV/V light curing adhesive, fluorescing.

Medium viscosity, UV/V light curing adhesive, fluorescing.

One-part, heat cure, toughened, highly flourescent, medium viscosity epoxy

One-part, heat-cure, toughened, non-sag, high viscosity, motor armature bonding epoxy

Medium viscosity, one-part room temperature cure, instant adhesive.

Low viscosity, surface insensitive, one part, room temperature cure, instant adhesive.

High viscosity, low odor/low bloom, one part room temperature cure, instant adhesive.

General maintenance and repair, one part, room temperature cure, instant adhesive.

Wicking grade, surface insensitive, one part, room temperature cure, instant adhesive.

Very low viscosity, low odor/low bloom, one part room temperature cure, instant adhesive.

High viscosity, clear toughened, one part, room temperature cure, instant adhesive.

High viscosity, thermal resistant, clear, rubber toughened, one part, room temperature cure, instant adhesive.

High viscosity, low odor/low bloom, one part room temperature cure, instant adhesive.

Gel, black, rubber toughened, one part, room temperature cure, instant adhesive.

High viscosity, low odor/low bloom, one part room temperature cure, instant adhesive.

High viscosity, one part, UV/V light rapid cure, instant adhesive.

High viscosity, gap filling, surface insensitive, one part, room temperature cure, instant adhesive.

Low viscosity, black, surface insensitive, rubber toughened, one part, room temperature cure, instant adhesive.

Gel, one part, surface insensitive, room temperature cure, instant adhesive.

Low viscosity, low odor/low bloom, one part room temperature cure, instant adhesive.

Low viscosity, black, rubber toughened, one part, room temperature cure, instant adhesive.

High viscosity, flexible, one part, room temperature cure, instant adhesive.

A high viscosity, non-toxic, water-based, preapplied thread sealant

One part, UV or visible light and moisture curing, high speed silicone

A low viscosity, non-toxic, water-based, preapplied thread sealant

One part, RTV silicone paste, excellent for adhesion

One part, dual cure; UV/moisture, acetoxy silicone; thixotropic paste for gasketing, sealing, and bonding

Used for gasketing and sealing applications

One part, dual cure; UV/moisture, acetoxy silicone; low viscosity for potting and encapsulating applications

Medium strength, high temperature flange sealant for hand dispensing or screen printing.

Low viscosity, high temperature (350°F), preapplied thread sealant for metal and plastics

Specifically formulated for bonding, sealing, and coating of electronic devices, especially for military, automotive and industrial electronic

A high viscosity, non-toxic water-based, preapplied thread sealant

Medium strength, fast curing flange sealant.

One part, dual cure, UV/moisture, alkoxy silicone; low viscosity, non-corrosive

Designed to provide environmental protection for printed circuit boards and other sensitive electronic components

Designed to bond metallic heat sinks, ceramic chips and circuit board substrates

Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures; cures to make a flexible, formed-in-place, electrically conductive bond.

Medium strength thread sealant for fine threads.

Plastic gasket.

One part humidity moisture curing elastic adhesive, silane modified polymer

Solvent resistant thread sealant. Recommended for refrigeration systems.

One part humidity moisture curing elastic adhesive, silane modified polymer

Low strength threadlocker for large diameter pipes.

General purpose, instant sealant, controlled strength thread sealant.

Plastic gasket.

Low strength thread sealant for course threads.

Fast curing, flange sealant.

Medium strength threadlocker for active and inactive metals and course threads.

High modulus, polyacrylate (ACM), formed-in-place flange sealant with UV tracers, excellent chemical resistance

One part RTV silicone, tough, flexible, directly on flange

One part RTV silicone, superior flexibility and adhesion, fast depth of cure, black

One part RTV silicone, superior flexibility and adhesion, excellent fluid resistance

Medium strength, lubricating, instant seal, slow cure thread sealant.

One part UV cure, secondary moisture cure, clear

High modulus, non-oxime, RTV silicone, form-in-place flange sealant

One part RTV cure silicone that retains high flexibility and oil resistance

Oil tolerant retaining compound.

Low viscosity, rapid-curing retaining compound to augment press fits.

Slip fit, high temperature, liquid retaining compound.

High strength retaining compound.

Medium strength retaining compound, press & slip fits, controlled strength.

A creamy, non-running adhesive/sealant

General purpose, bonds and seals, machinable, gap filling, grey epoxy

Increases cure speed of Loctite ® instant adhesives

Increases cure speed of instant adhesives

Non-CFC, low odor, solvent based formulation intended for the removal of uncured adhesive and adhesive residues used in the PCB assembly industry

Increases cure speed of instant adhesives and has aggressive cleaning properties

Polyamide hot melt adhesive is formulated for long open time and high output

Adhesion promoter for instant adhesives on hard-to-bond plastics and elastomers

Flame retardant, polyamide, hot melt adhesive

High performance, polyamide hot melt

Adhesion promoter, non-flammable, for instant adhesives on hard-to-bond plastics and elastomers

General purpose, mix ratio insensitive, surface intolerant, 20 minute working life epoxy

General purpose, self leveling, flowable, potting, flexible, 65 minute working life epoxy

One-part paste, heat-cure, excellent high temperature performance and chemical resistance, non-sag, surface insensitive epoxy

One-part medium viscosity, heat-cure, excellent high temperature performance and chemical resistance, self-leveling, white epoxy

Impact resistant, high viscosity epoxy, high peel, high shear strength, non-sag, extended 100 minute working life for bonding printing blanket stock

Impact resistant, toughened, non-sag, medium viscosity epoxy with a 55 minute working life

Preapplied, "dry" anti-seize lubricant

Slow-drying, non-hardening brushtop for aviation and automotive applications

Low viscosity, rapid-curing retaining compound to augment press fits.

High viscosity, high temperature retaining compound.

Single-component, elastomeric, anti-slip, floor and deck coating

For heavy pedestrian or light rolling traffic

Two-component, epoxy-polymide, metal primer

Specially formulated to increase adhesion and coverage of anti-slip coatings

Solid film protection for engine parts, bearings, and servo-mechanisms

Removes gaskets from any type of assembly in 10 to 15 minutes

Highly resistant to salt corrosion and water, not resistant to acid or alkaline solutions.

Color guard thinner for rubber coating

Professional contact adhesive for weatherstripping and general purpose bonding.

Premium quality copper anti-seize and thread lubricant.

Copper based anti-seize in a semi-solid stick

Fast drying, metallic copper sealant.

Fast setting, clear, medium viscosity, electrically insulative, chemical resistant epoxy

Provides moisture proof barrier with a high dielectric strength.

Fast setting, flowable, low odor, clear, low viscosity epoxy

Fast setting, toughened, high peel, clear, low viscosity, low odor epoxy

High performance, ultra-strength, non-sag, aerospace grade epoxy with a 20 minute working life

One-part, heat cure, high temperature resistant, non-sag, grey epoxy

General purpose, flexible, impact resistant, grey epoxy with a 40 minute working life

General purpose, electrically non-corrosive, potting compound, low viscosity epoxy with a 60 minute working life

Fast-evaporating, no CFCs or HCFCs.

One-step rust treatment. Destroys old rust and prevents new rust.

Single component putty.

Aluminum liquid which sets in 20 minutes.

Chemical anchor bolt grout

Permanent, concrete repair in a convenient stick.

Caulking gun grade epoxy concrete crack repair.

Etching agent for conveyor belt repair

Grout, self-leveling, non-shrinking, up to 1" deep.

Fast setting steel putty. Sets in 3 minutes.

Trowelable, two-part, general purpose putty.

Metal primer for use with urethane belt repair products

Single-component, heat-curing, temporary belt repair.

Self-leveling, fast curing, non-shrinking grout

Fast cure epoxy, general purpose

Stainless steel filled steel putty

Non-slumping, two-part, steel-filled putty

Non-rusting, ferro-silicone-filled epoxy

Ceramic fibers, trowelable, excellent wear and abrasion resistant