With the industry now in full transition to lead-free manufacturing, leading electronics firms around the globe are partnering with Henkel to ensure a smooth Pb-free conversion and a long-term materials solution.
Also thermal cycling and environmental protection are tantamount in today’s advanced electronics market and Henkel is committed to delivering a wide variety of material solutions that provide durability and protection.
Smaller. Better. Faster. Cheaper. No four words more aptly describe the state of the semiconductor packaging market.
Driven by consumers’ relentless push for smaller, yet more powerful and less costly products, Henkel’s semiconductor specialists are constantly pushing the envelope when it comes to device packaging.
Things are heating up in electronics manufacturing – literally. The pace of device footprint reduction combined with consumer-driven increased functionality demands is pushing the thermal management capabilities of many packages to the brink.
No doubt that effective heat transfer will be one of the most critical aspects of device design and manufacture in the coming decade. Solutions from Henkel will help you to stay cool.
Printed circuit board assembly (PCB)
Henkel’s line of Multicore® Solder Materials, Loctite® surface mount adhesives, CSP Underfills and circuit protection materials delivers the performance, reliability and material set compatibility required to meet the diverse manufacturing needs of today’s leading electronics companies.
Printed circuit board protection (PCB)
Henkel offers a full suite of PCB protection products including conformal coatings that keep moisture, humidity and other adverse conditions from deteriorating printed circuit boards used in harsh applications and potting and encapsulation compounds that provide full environmental resistance
Henkel’s semiconductor products, which include package level underfills, mold compounds and die attach materials are world-renowned for their performance, reliability and outstanding capabilities even in the face of changing manufacturing conditions such as lead-free.
Thermal management will remain one of the biggest challenges for modern electronics production and a top materials development priority for Henkel. Our thermal materials scientists have developed some unique and user-friendly products to address thermal transfer priorities.