Smaller. Better. Faster. Cheaper. No four words more aptly describe the state of the semiconductor packaging market. Driven by consumers’ relentless push for smaller, yet more powerful and less costly products, semiconductor specialists are constantly pushing the envelope when it comes to device packaging.
And, it’s why Henkel is consistently at the forefront of technology, developing unique materials solutions for the never-ending demands of today’s advanced products. Take our material set philosophy, for example.
At Henkel, we understand that you don’t have the time and resources to test multiple materials for compatibility.
We take the guesswork out of the process and deliver tested, reliable and guaranteed compatible material sets for the most demanding applications. Through materials that are specifically designed to work in concert with one another, packages are manufactured at high-yield and low-cost.
Henkel’s Hysol® brand of semiconductor products, which include package level underfills, mold compounds and die attach materials are world-renowned for their performance, reliability and outstanding capabilities even in the face of changing manufacturing conditions such as lead-free.
Want to deliver the smaller, better, faster and more cost-efficient products your customers demand? We’ve got you covered.
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